Radant MEMS Switch (continued)
Radant MEMS has been manufacturing devices in the current configuration since 1999. An established fabrication process ensures scalability to meet customer demands.
Switch Fabrication Process
Source, Gate, Drain and bond pad metal are deposited and defined.
The beam and interconnects are deposited by electroplating over the Source.
The cap wafer is micromachined. The switch and cap wafers are aligned and bonded.
The cap wafer is removed from the areas not sealing the switches, and the bonded wafer-pair is singulated to obtain capped die.
Applications and Benefits