The RF MEMS microswitch is a 3-terminal device that employs a cantilever beam and is fabricated using an all-metal, surface micromachining process on high-resistivity silicon. It operates in a hermetic environment obtained through a wafer-bonding process.
Applications and Benefits
Wafer packaging is more cost effective than either custom or ceramic packaging. It also offers a direct connection to the customer's system, thereby reducing complexity and increasing reliability.